Using Undissolved Ozone in Semiconductor Cleaning Applications

This article explores the growing use of dissolved ozone as an advanced cleaning and disinfection technology in semiconductor manufacturing. The authors examine how ozonated ultrapure water can effectively remove organic contaminants, particles, metals, and photoresist residues while reducing the chemical consumption, waste generation, and environmental impact associated with traditional cleaning methods. The paper reviews several ozone-based wafer cleaning processes and presents research demonstrating that ozone can achieve cleaning performance equal to or better than conventional RCA cleaning techniques. The findings highlight dissolved ozone as a practical, cost-effective, and environmentally responsible solution for improving wafer cleanliness, process efficiency, and device performance in modern semiconductor fabrication.