Ultraviolet-Ozone Cleaning of Semiconductor Surfaces

This report examines the use of ultraviolet (UV) light and ozone as a dry-cleaning technology for semiconductor surfaces. The process effectively removes organic contaminants by converting them into volatile compounds, producing exceptionally clean surfaces without the use of chemicals. The paper discusses the cleaning mechanism, operating parameters, equipment design, safety considerations, and applications in semiconductor manufacturing, highlighting UV/ozone cleaning as a fast, cost-effective, and environmentally friendly alternative to conventional cleaning methods.